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Causes and solutions of empty welding of wave solder joints

source: Anhui guangshengde automation equipment Co., Ltd popularity:791 Time of publication:2021/09/10 10:43:02 small middle big
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The empty soldering of wave solder joints is also commonly referred to as missing soldering. Most of the pins of the other components on the circuit board have been soldered with tin, but some are not soldered with tin. This is the empty soldering of wave solder joints, Guangsheng Deutsche Technology will share with you the causes and solutions of the wave solder joints and empty soldering.



Causes of empty soldering in wave solder joints

If the wave solder joints produce empty soldering, first check whether the board travel speed is reasonable, and then check whether the flux is sprayed on the PCB board, check whether the sensor senses or receives a signal, whether the nozzle sprays well and is not blocked, on both sides of the track Whether it is balanced, whether the claws are deformed, whether the wave crest is flat, whether the wave crest is adjusted too low, or the position of the furnace solder is too low!


The reasons for the empty soldering of the wave solder joints may also be: poor PCB hole walls and good solderability; PCB or components are damp; the circuit board passes the wave furnace too fast; the component pins are too long; the flux activity is insufficient These reasons may lead to missing soldering!


波峰焊點(diǎn)空焊

Wave solder joints


Wave solder joint empty welding solution

There are many reasons for the occurrence of empty soldering on circuit boards after wave soldering, and specific problems need to be analyzed in detail and carefully investigated on the spot. You can find the solution only after you find the reason. You can try the following solutions.

1. Soldering materials such as PCB and components are used on a first-come-first-served basis. Do not store in a humid environment. Do not exceed the specified use date. Clean and dehumidify the printed board;

2. The residue should be cleaned up after finishing work every day;

3. Use a suitable flux coating method to obtain a uniform coating amount. The more flux is not applied, the better;

4. Adjust the process parameters, appropriately increase the wave soldering angle or slow down the wave soldering speed, and control the preheating temperature and soldering conditions;

5. Avoid pollution during operation;

6. The wave height is generally controlled at 2/3 of the thickness of the printed board;

7. Reasonable matching of plates and components.

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